thinkpool

특허취득 
  증권거래법 제186조의 규정에 의하여 당사의 주요경영사항에 대해 다음과 같이 신고ㆍ공시 
  합니다. 
 
 
                                    2006년  09 월  07 일 
 
                              금융감독위원회(금융감독원) 귀중 
 
 
  회   사   명 :                DK 유아이엘 주식회사 
       (영문명)                 DK UIL Co., Ltd. 
       (홈페이지)               http://www.dkuil.com 
 
 
  본 점 소 재 지 :              경기도 파주시 광탄면 마장리 76-1 
       (전   화)                031)948-1234 
 
 
  대 표 이 사 :                 박    종    흠 
 
 
  담 당 임 원 :                 (직  책) 이    사 
                                (성  명) 김    병    훈       (전  화) 031)948-1234 
 
 
 
  작   성   자 :                (직  책) 과    장 
                                (성  명) 박    종    관       (전  화) 031)940-1535 
 
 
 
  제 출 이 유 :                 유가증권의발행및공시등에관한규정 제69조제1항제5호마목에 의 
                                한 
                                특허취득 
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| ※ 본 건 금융감독위원회(금융감독원)에 제출하는 주요경영사항 신고는 증권거래법 제186조,   | 
| 동법 시행령 제83조 및 유가증권의발행및공시등에관한규정 제69조에 의한 『법정공시사항』으  | 
| 로 그 내용에 허위, 중요사실의 누락이 있을 경우 증권거래법 제206조의11, 제207조의3에 의거 | 
|  과징금 부과, 형사처벌 등 제재를 받을 수 있습니다.                                       | 
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| 1. 특허명칭                               |           연성회로기판 패터닝 방법           | 
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| 2. 특허 주요내용                          | 본 발명은 금속도금층을 부여하기 이전에 패터  | 
|                                           | 닝 과정을 진행토록 하여 균일하고 얇은 두께를 | 
|                                           |  유지하고 있는 상부 금속박막층 및 하부 금속  | 
|                                           | 박막층에 보다 정교하고 정밀한 상부 패턴 및   | 
|                                           | 하부 패턴을 구현할 수 있도록 하며, 아울러 무 | 
|                                           | 전해 도금층을 부여한 후 곧바로 패터닝 공정을 | 
|                                           |  취하면서 부분 마스킹부의 제공에 이은 비아홀 | 
|                                           | 을 포함한 오픈영역에 부분 금속도금층을 형성  | 
|                                           | 하여 신뢰성 및 정교성을 크게 향상시킬 수 있  | 
|                                           | 는 연성회로기판 패터닝 방법에 관한 것이다.   | 
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| 3. 특허권자                               |             DK 유아이엘 주식회사             | 
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| 4. 특허취득일자                           |               2006년 09월 07일               | 
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| 5. 특허 활용계획                          | - 연성회로기판의 국내 자체 기술 확보로 인한  | 
|                                           |  기술 선점                                   | 
|                                           | - 연성회로기판의 경쟁력 확보                 | 
|                                           | - 연성회로기판의 생산 및 판매에 활용         | 
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| 6. 확인일자                               |               2006년 09월 07일               | 
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7. 기타 투자판단에 참고할 사항